Skip to content

PHOTONICPARTS_Logo_Full

Packaging and Joining Technologies

Designed for highest requirements - individually adaptable

Precise

  • Sub-micron accuracy in alignment and bonding

  • Flux-free vacuum soldering for optical components

  • Reliable performance for high-end photonic applications

Robust

  • Hermetic and long-term stable connections

  • High thermal conductivity for demanding environments

  • Proven durability in laser, aerospace, and quantum systems

Customizable

  • Tailored designs for specific optical setups

  • Flexible material pairings and coatings

  • Scalable solutions from prototypes to series production

Lorem ipsum dolor sit amet, consectetur adipiscing elit. Duis accumsan velit sit amet sagittis malesuada.

Photonic Components

Field of application

PHOTONICSPART_Soldered laser crystal packages
white_icon_transparent_background

Soldered laser crystal packages
Yb:YAG, Nd:YAG, Yb:KYW …

  • Homogenous heat dissipation over entire crystal surface area
  • CTE-matched heatsink material pairing
  • Active/passive cooled
  • Dimension/dopant concentration of crystal can be adapted to customer’s need 
  • Packaged crystals are not available on the market by now
color1-white_icon_transparent_background

Soldered non-linear crystal packages
SHG, THG, OPO

  • CTE-matched heatsink material pairing for NL-crystals
  • Including high precision heater
  • Sealed box to prevent contamination and to extend lifetime
PHOTONICSPART_Soldered non-linear crystal packages
PHOTONICSPART_Soldered optics, lightweight mirrors
white_icon_transparent_background

Soldered optics, lightweight mirrors, metal/glass/ceramics composites

  • Possibility of assembling glass/metal/ceramics composites
  • Allows centering, screwing of mounted optics
  • Lightweight design (e.g. ceramics honeycomb)
  • Rear side cooling option

Our processes | Your solution

As the used technology offers wide range market application we are always open for new tasks.
Since we have many relevant processes inhouse, we can easily adapt our technology to customers.

PHOTONICPARTS_CAD Construction and simulation
PHOTONICSPART_PVD solder deposition
PHOTONICSPART_High vacuum soldering
PHOTONICSPART_Ultrasonic cleaning
PHOTONICSPART_Magnetron sputterimg
PHOTONICSPART_Pick and Align Robot
PHOTONICSPART_Quality control
PHOTONICSPART_Climate stress testing
  • PHOTONICSPART_CAD Construction and simulation
    CAD Construction and simulation
  • PHOTONICSPART_Ultrasonic cleaning
    Ultrasonic cleaning
  • PHOTONICSPART_Magnetron sputterimg
    Magnetron sputterimg
  • PHOTONICSPART_PVD solder deposition
    PVD solder deposition
  • PHOTONICSPART_High vacuum soldering
    High vacuum soldering
  • PHOTONICSPART_Climate stress testing
    Climate stress testing
  • PHOTONICSPART_Quality control
    Quality control
  • PHOTONICSPART_Clean Room Laser Production
    Clean Room Laser Production
  • PHOTONICSPART_Pick and Align Robot
    Pick and Align Robot

Products and Solutions based on Soldering

Highly precise and robust laser components and subsystems based on soldering technology

PHOTONICPARTS_Productrange2
Photonicparts_LaserCrystals-1
Photonicparts_NLO-1
Photonicparts_Mirrormount-1
Produkt 6-1
Produkt 5-1
Produkt 4-1
Produkt 1-1

News Blog

CIOE 2023 china

CIOE 2023 china

We will be represented on CIOE 2023 (The 24th China International Optoelectronic Exposition) by our...

Read more

Technology

PHOTONICPARTS_CMount_NLO

Precision joining for photonic excellence

At PHOTONICPARTS, we specialize in high-performance packaging and assembly solutions for laser and photonic components. Our core expertise lies in flux-free-vacuum soldering, packaging technologies, robust thermal management, and hermetic sealing technologies. From laser crystal packaging to complex optics and subsystems for quantum, we integrate optical elements in a reliable and scalable manner thanks to our advanced joining processes. Whether it’s for highpower laser cooling, quantum applications, or aerospace-grade components – our solutions are made to last and withstand harsh environments.

Our Technology

  • Flux-free vacuum soldering for optical, metallic & ceramic components
  • Active surface preparation: Applying of solderable metallization of nearly all materials
  • Low-melting solders tailored to thermal & mechanical needs
  • Thin-film to thick-layer solder deposition via PVD technology
  • Robust bonding layers with excellent thermal and mechanical stability
  • Stress-optimized joints – ideal for laser cooling,vacuum and immersion optics
  • Hybrid assemblies with electrical, optical and fluidic interfaces
  • Packaging solutions from lab-scale/
    demonstrators to industrial series integration
Seite8 Bild1

Company

  • PHOTONICPARTS is a trademark of XCCES GmbH
  • works in the field of joining and assembly technologies and production of optical components
  • major fields are packaging, adjustment and thermal management
  • founded by Dr. Jan Dolkemeyer and Phillip Dittmann in August 2023
  • Located in Herzogenrath, North-Rhine-Westphalia, Germany
  • 900sqm production and office space
  • 13 Employees
  • susidiary CoreCooling GmbH founded 03/25 as JV
PHOTONICPARTS_Headquarter
1 PHOTONICPARTS Headquarter in Herzogenrath, Germany
PHOTONICPARTS_Office1
2 Modern and lightflooded office space
PHOTONICPARTS_Lab1
3 Lab Workbench in Cleanroom Condition
PHOTONICPARTS_Office2
4 Lab Space
WhatsApp Bild 2025-09-03 um 10.31.47_cc0660b4
5 PHOTONICPARTS Team

Upcoming Tradshows

PW-2026

Worldwide Distributors

PHOTONICPARTS_HOCHLASER
LOGO TaiheiBoeki

China

Japan

Partners and Networks

 

PHOTONICPARTS_EPIC
PHOTONICPARTS_LaserregionAachen
PHOTONICPARTS_Meetoptics2
optence
PHOTONICPARTS_Funckoptics
PHOTONICPARTS_OPTOMAN_2
PHOTONICPARTS_Aixemtec
PHOTONICPARTS_EUPIO
Phillip Dittmann

 

Phillip Dittmann

Founder & Managing Partner

Phillip Dittmann has more than 12 years experience in the international photonic market due to his work at Fraunhofer ILT and AMPHOS GmbH. During his work at AMPHOS Mr. Dittmann led heterogenous r&d, production and service teams and has deep-technical know-how in the fields of ultra-short-pulse laser technology, high-vacuum solder techniques, mechanical design and optics.

 

 

C88A1526

 

Dr. Jan Dolkemeyer

Founder & Managing Partner

As a scientific assistant at the Fraunhofer Institute for Laser Technology, Dr. Jan Dolkemeyer developed fundamental soldering techniques for sensitive electro-optical components in the field of laser technology. These soldering techniques are an essential core know-how of AMPHOS GmbH, of which he was a co-founder in 2011. AMPHOS GmbH produces high-power ultrafast lasers for material processing. Dr. Jan Dolkemeyer served as managing director overseeing production as well development until the end of 2022 . In 2018, AMPHOS GmbH has been acquired by the Trumpf Group.

Latest posts

Lorem ipsum dolor sit amet, consectetur adipiscing elit.

Contact us